PTM7950 by CSGR® 40×40×0.25 mm phase change thermal pad for CPUs/GPUs; 8.5 W/m·K*
PTM7950 by CSGR® 40×40×0.25 mm & K5-PRO 20g set
PTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
PTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
Liquid Metal by CSGR 1g – 79 W/m·K* high performance thermal interface for CPU/GPU upgrades
Liquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
K4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
K4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
KRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
K5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
K5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
Tech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
Ultimate Repaste KIT – K5-PRO 10g thermal putty + KRYO33 3g high performance paste
CS-FLUX 5g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
CS-FLUX 10g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
CS-FLUX 10g (2x5g) – halogen-free, lead-free no-clean flux for SMD microsoldering
CS-FLUX 15g (3x5g) – halogen-free, lead-free no-clean flux for SMD microsoldering
UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
K5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
K5-PRO 10g applicator tube (syringe style) – DIY thermal putty for pad replacement
K5-PRO® Mt. Olympos Edition 33g UV reactive thermal putty for pad replacement; >15 W/m·K*
K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
K5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
K5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
BGA COAT Underfill Kit (50 ml Binder A + 25 g Filler B) – non epoxy, thermal, pro use
Diagnostics for Seagate (DfS) USB toolkit
FileChecker by CS – Post recovery file quality checker software, 1PC full license (download)
FW-FXR kit – compatible with Seagate 7200.11/12 & Maxtor DiamondMax; fixes BSY and 0 MB
CSGR Data Recovery Tools Set – FW-FXR, DfS & FileChecker; Seagate SATA compatible
Showing the single result
Three 20 g jars for active benches and parallel work flows; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C.