Showing all 13 results
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Liquid Metal by CSGR 1g – 79 W/m·K* high performance thermal interface for CPU/GPU upgrades
THERMAL PASTESLiquid Metal by CSGR 1g – 79 W/m·K* high performance thermal interface for CPU/GPU upgrades
Ultrahigh thermal conductivity compound for serious cooling projects; electrically conductive and designed for controlled application. Compatible with K5-PRO® thermal putty as a protective barrier to help prevent migration during long operation.
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Liquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
SET OF PRODUCTS & THERMAL PASTESLiquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
High performance cooling bundle that pairs liquid metal for direct die CPU/GPU use with K5-PRO® non conductive putty to fill gaps and create a protective perimeter—safer installs, stronger thermal contact, cleaner results.
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PTM7950 by CSGR® 40×40×0.25 mm & K5-PRO 20g set
Synergistic bundle: PTM7950 by CSGR® phase change pad for CPU/GPU heat spreaders plus K5-PRO high viscosity thermal putty for VRAM/VRM and frame contact. DIY friendly, non conductive, fills up to 3 mm (≈1 mm optimal) and stabilizes thin or uneven heat sinks.
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PTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
SET OF PRODUCTS & THERMAL PASTESPTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
Dual material cooling kit that pairs a phase change pad for CPU/GPU dies with a soft, lightly tacky 12.8 W/m·K* thermal putty for GDDR6 VRAM and power stages; DIY friendly, optimized around 0.25 mm and 1–2 mm bond lines.
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PTM7950 by CSGR® 40×40×0.25 mm phase change thermal pad for CPUs/GPUs; 8.5 W/m·K*
High performance phase change pad (melts near 45°C) that wets surfaces, fills micro gaps, and resolidifies for stable contact; electrically non conductive; ideal with modern GDDR6 VRAM, chipsets, and compact heat spreaders.
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PTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
SET OF PRODUCTS & THERMAL PASTESPTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
Phase change pad (8.5 W/m·K*) plus high viscosity putty (16.8 W/m·K*) to restore full contact in 2–4 mm gaps—ideal for water cooling cold plates, desktop GPUs, and PlayStation 5 assemblies.
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K4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTESK4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Apply and forget, non conductive silicone paste that wets micro gaps and stays stable; designed for business PCs, terminals, kiosks, fanless devices and industrial electronics where routine reopening isn’t planned.
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K4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTESK4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Bulk workshop jar for production and fleet service; apply and forget, non conductive paste that spreads thin, fills micro gaps and stays stable up to 220 °C in industrial, commercial and fanless platforms.
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KRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
THERMAL PASTESKRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
Premium CPU/GPU compound with >13 W/m·K* conductivity and ultralow thermal resistance (<0.004 K/W); zero electrical conductivity; no curing time; engineered to spread thin, fill micro gaps and deliver durable, long term stability.
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K5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTYK5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
Complete thermal service in one set: K5-PRO putty (>5.3 W/m·K*) for pad replacement and gap filling up to ~3 mm, plus K4-PRO silicone paste (>4.6 W/m·K*) for CPU/GPU dies—clean results for DIY and professional benches.
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K5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTYK5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
Shop ready pairing: K5-PRO putty (>5.3 W/m·K*) to replace soft pads and fill up to ~3 mm gaps, plus K4-PRO silicone paste (>4.6 W/m·K*) for a longlife die interface—organized, repeatable results on common repairs.
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Tech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
SET OF PRODUCTS & SOLDERING FLUX & THERMAL PASTES & THERMAL PUTTYTech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
Three-piece repair set for laptops, desktops and consoles: non conductive thermal putty (>5.3 W/m·K*), high performance thermal paste (>13 W/m·K*), and lead-free, halogen-free no-clean flux for precise SMD work.
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Ultimate Repaste KIT – K5-PRO 10g thermal putty + KRYO33 3g high performance paste
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTYUltimate Repaste KIT – K5-PRO 10g thermal putty + KRYO33 3g high performance paste
Two part CPU/GPU service set for mixed interfaces: KRYO33 >13 W/m·K* on the die, K5-PRO >5.3 W/m·K* for pad replacement zones up to ~3 mm; non conductive, zero curing time, DIY friendly workflow.