Showing all 4 results
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K4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTESK4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Bulk workshop jar for production and fleet service; apply and forget, non conductive paste that spreads thin, fills micro gaps and stays stable up to 220 °C in industrial, commercial and fanless platforms.
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UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTYUPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.
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UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
THERMAL PUTTYUPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
Soft, lightly tacky compound optimized for ~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed for gaming laptops and compact systems; easy, clean application for all skill levels.
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K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
THERMAL PUTTYK5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
High volume 400 g jar for labs and refurbishers; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; decant for microscope work.