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PTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
SET OF PRODUCTS & THERMAL PASTESPTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
Phase change pad (8.5 W/m·K*) plus high viscosity putty (16.8 W/m·K*) to restore full contact in 2–4 mm gaps—ideal for water cooling cold plates, desktop GPUs, and PlayStation 5 assemblies.
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UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
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UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.
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UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTYUPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.