Showing all 18 results
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Liquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
SET OF PRODUCTS & THERMAL PASTESLiquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
High performance cooling bundle that pairs liquid metal for direct die CPU/GPU use with K5-PRO® non conductive putty to fill gaps and create a protective perimeter—safer installs, stronger thermal contact, cleaner results.
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PTM7950 by CSGR® 40×40×0.25 mm & K5-PRO 20g set
Synergistic bundle: PTM7950 by CSGR® phase change pad for CPU/GPU heat spreaders plus K5-PRO high viscosity thermal putty for VRAM/VRM and frame contact. DIY friendly, non conductive, fills up to 3 mm (≈1 mm optimal) and stabilizes thin or uneven heat sinks.
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UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
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UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.
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UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTYUPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.
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UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
THERMAL PUTTYUPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky; ideal layer thickness ~1–2 mm for GDDR6 VRAMs, VRM stages, and controller chips in gaming laptops and slim consoles.
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UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTYUPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky thermal putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm for tight, thin heat sinks; targets GDDR6 VRAMs, hot VRM stages, display/I/O controller chips; easy for beginners to apply.
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UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTYUPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs, VRM stages and controller chips; easy for amateur users to apply cleanly.
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UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
THERMAL PUTTYUPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
Soft, lightly tacky compound for tight layouts; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs and VRM stages; easy for beginners; workshop capacity for repeated services.
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UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
THERMAL PUTTYUPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
Soft, lightly tacky compound optimized for ~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed for gaming laptops and compact systems; easy, clean application for all skill levels.
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K5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTYK5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Lipstick-style twist-up tube for clean, tool free dosing in tight spaces; solves >90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
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K5-PRO 10g applicator tube (syringe style) – DIY thermal putty for pad replacement
Precise, low pressure dosing from a syringe style applicator tube; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
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K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTYK5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Shapeable, high viscosity putty solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C; ideal for VRAM/VRM and heat bridging to housings.
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K5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
THERMAL PUTTYK5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
Three lipstick-style twist-up tubes for multi station benches and travel kits; solves >90% of pad replacement cases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
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K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
THERMAL PUTTYK5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
Three 20 g jars for active benches and parallel work flows; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C.
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K5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
THERMAL PUTTYK5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
Six lipstick-style twist-up tubes for training, classrooms, and parallel benches; solves >90% of pad replacement cases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
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K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
THERMAL PUTTYK5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
Large workshop jar for extended service; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; reliable for VRAM/VRM and heat bridging projects.
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K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
THERMAL PUTTYK5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
High volume 400 g jar for labs and refurbishers; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; decant for microscope work.