Showing all 20 results
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PTM7950 by CSGR® 40×40×0.25 mm phase change thermal pad for CPUs/GPUs; 8.5 W/m·K*
High performance phase change pad (melts near 45°C) that wets surfaces, fills micro gaps, and resolidifies for stable contact; electrically non conductive; ideal with modern GDDR6 VRAM, chipsets, and compact heat spreaders.
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K4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTESK4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Apply and forget, non conductive silicone paste that wets micro gaps and stays stable; designed for business PCs, terminals, kiosks, fanless devices and industrial electronics where routine reopening isn’t planned.
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K4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTESK4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Bulk workshop jar for production and fleet service; apply and forget, non conductive paste that spreads thin, fills micro gaps and stays stable up to 220 °C in industrial, commercial and fanless platforms.
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KRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
THERMAL PASTESKRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
Premium CPU/GPU compound with >13 W/m·K* conductivity and ultralow thermal resistance (<0.004 K/W); zero electrical conductivity; no curing time; engineered to spread thin, fill micro gaps and deliver durable, long term stability.
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K5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTYK5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
Complete thermal service in one set: K5-PRO putty (>5.3 W/m·K*) for pad replacement and gap filling up to ~3 mm, plus K4-PRO silicone paste (>4.6 W/m·K*) for CPU/GPU dies—clean results for DIY and professional benches.
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K5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTYK5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
Shop ready pairing: K5-PRO putty (>5.3 W/m·K*) to replace soft pads and fill up to ~3 mm gaps, plus K4-PRO silicone paste (>4.6 W/m·K*) for a longlife die interface—organized, repeatable results on common repairs.
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Tech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
SET OF PRODUCTS & SOLDERING FLUX & THERMAL PASTES & THERMAL PUTTYTech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
Three-piece repair set for laptops, desktops and consoles: non conductive thermal putty (>5.3 W/m·K*), high performance thermal paste (>13 W/m·K*), and lead-free, halogen-free no-clean flux for precise SMD work.
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UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
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UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.
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UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTYUPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.
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UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
THERMAL PUTTYUPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky; ideal layer thickness ~1–2 mm for GDDR6 VRAMs, VRM stages, and controller chips in gaming laptops and slim consoles.
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UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTYUPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky thermal putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm for tight, thin heat sinks; targets GDDR6 VRAMs, hot VRM stages, display/I/O controller chips; easy for beginners to apply.
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UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTYUPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs, VRM stages and controller chips; easy for amateur users to apply cleanly.
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UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
THERMAL PUTTYUPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
Soft, lightly tacky compound for tight layouts; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs and VRM stages; easy for beginners; workshop capacity for repeated services.
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UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
THERMAL PUTTYUPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
Soft, lightly tacky compound optimized for ~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed for gaming laptops and compact systems; easy, clean application for all skill levels.
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K5-PRO 10g applicator tube (syringe style) – DIY thermal putty for pad replacement
Precise, low pressure dosing from a syringe style applicator tube; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
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K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTYK5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Shapeable, high viscosity putty solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C; ideal for VRAM/VRM and heat bridging to housings.
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K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
THERMAL PUTTYK5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
Three 20 g jars for active benches and parallel work flows; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C.
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K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
THERMAL PUTTYK5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
Large workshop jar for extended service; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; reliable for VRAM/VRM and heat bridging projects.
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K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
THERMAL PUTTYK5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
High volume 400 g jar for labs and refurbishers; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; decant for microscope work.