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UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
THERMAL PUTTYUPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
Soft, lightly tacky compound for tight layouts; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs and VRM stages; easy for beginners; workshop capacity for repeated services.
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K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
THERMAL PUTTYK5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
Large workshop jar for extended service; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; reliable for VRAM/VRM and heat bridging projects.