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UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
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UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTYUPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.